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三星电子设备解决方案DS）部门已着手开发下一代封装材料“玻璃中介层”，目标不仅是取代昂贵的硅中介层，还要提升芯片性能。据报导，三星电子最近收到澳洲材料商Chemtronics和南韩设备商Philopt

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从制造工艺角度解析，漂浮型与非浮型铝银浆的分水岭在于表面包覆技术的差异。非浮型铝浆在研磨工序中通过油酸分子层实现铝片的定向排列，这种结构使其在漆膜干燥后稳定存在于中下层空间，赋予涂层低调的金属质感。相

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